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SPE4A527R0018,5998010865949, Circuit Card ASSEMB,601-4172-001

11 days left Sources sought Open to all NAICS 334418 Deadline extended Oct 20

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AgencyDepartment of Defense
Defense Logistics Agency
Contracting officeDLA Aviation
Place of performanceRichmond, VA
Type of noticeSources sought
Set-asideNone, open to all businesses
Response deadlineNov 4, 2026
PostedOct 20, 2026
Solicitation numberSPE4A527R0018
NAICS code334418, Printed Circuit Assembly (Electronic Assembly) Manufacturing

Read the official notice on SAM.gov

Change history

1 change between the versions of this notice on SAM.gov, newest first.

  1. Deadline extended
    • Deadline extended from Oct 19, 2026 to Nov 4, 2026
    • Description text changed

From the daily public SAM.gov data. That data doesn't list attachments, so open the official notice to download new or revised documents. All recent amendments.

Summary from the notice

Purchase Request: 7008074221, NSN: 5998010865949, CIRCUIT CARD ASSEMB, IAW Part Number: 601-4172-001. Specifications, plans, or drawings relating to the procurement described are not available and cannot be furnished by the Government. DLA Aviation does not currently have an approved technical data package for this item, therefore, please do not submit requests. The only approved source for this material is Rockwell Collins, Inc., Cage 13499. Any manufacturer, other than the approved source, must submit a complete source approval package (SAR). This solicitation will result in a firm fixed-fixed price contract. The requirement is for 91 each. The required delivery is 244 days ARO to DLA Distribution San Diego, San Diego, CA. This is an Unrestricted Acquisition. Other Than Full and Open Competition applies, Sole Source per (FAR 6.302). FOB Origin, Inspection and Acceptance Destination applies. The use of the SPRS/PPIRS is applicable. The final contract award decision may be based upon a combination of price, past performance and other evaluation factors as described in the solicitation. All responsible sources may submit a proposal to be considered. A letter will be utilized to solicit the Request for Proposal (RFP) as there is currently a Basic Ordering Agreement (BOA) in place. A copy of the solicitation will not be available via the DLA-BSM Internet Bid Board System (DIBBS). A copy of this solicitation will only be available to interested requesters by contacting the buyer …

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Details copied from the public SAM.gov notice. BidFox is not connected to SAM.gov or the U.S. Government, so check the official notice before you bid.

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